LED LIGHTING DEVICE INCLUDING LED PACKAGE INTEGRALLY FORMED WITH A CIRCUIT BOARD, AND METHOD OF PRODUCING THE LED LIGHTING DEVICE
摘要
An LED lighting device according to an aspect of the present invention comprises a housing configuring the exterior of the device and an LED package. The LED package includes a plate-shaped circuit board, a plurality of LED devices mounted on the circuit board, and a light transmitting resin layer covering the LED devices and including an optical pattern formed on the surface thereof.
申请公布号
WO2011074777(A2)
申请公布日期
2011.06.23
申请号
WO2010KR07659
申请日期
2010.11.02
申请人
KOREA INSTITUTE OF MACHINERY & MATERIALS;JEON, EUN-CHAE;JE, TAE-JIN;YOO, YEONG-EUN;YOON, JAE-SUNG;CHOI, DOO-SUN;CHO, SUNG-HAK