| 摘要 |
Provided is a bonding wire antenna communication module. The bonding wire antenna communication module comprises: a semiconductor chip including bonding pads arranged on a substrate; and bonding wire antennas electrically connected to the bonding pads. The semiconductor chip of the communication module comprises inexpensive CMOS amplifiers, and each of the amplifiers operates at the highest efficiency, thereby providing an inexpensive, high-efficiency and optimized highly integrated communication module. |
