发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <p>PURPOSE: A substrate processing device is provided to prevent the rear of a wafer from contacting with a substrate loading plate when a wafer is loaded on a substrate loading plate. CONSTITUTION: A substrate loading plate(40) includes two arm units(41a,41b) which are extended with a plate shape. A substrate loading unit(44a,44b) and a misalignment preventing unit(42a,42b) are installed on the leading ends of the substrate loading unit. The misalignment preventing unit prevents the misalignment of a wafer when the wafer is loaded. An attaching unit(52) with an attaching hole(53) is installed on the source of the substrate loading plate.</p>
申请公布号 KR20110069696(A) 申请公布日期 2011.06.23
申请号 KR20100100642 申请日期 2010.10.15
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 TANIYAMA TOMOSHI
分类号 H01L21/677;H01L21/324;H01L21/683 主分类号 H01L21/677
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