| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of polishing a semiconductor wafer capable of restricting deterioration in surface roughness near the center of a semiconductor wafer to be obtained in machining for polishing the semiconductor wafer. <P>SOLUTION: This is a method of polishing a semiconductor wafer by supplying slurry onto a polishing cloth in the state of pressing a semiconductor wafer held by a work carrier 4 and a polishing cloth 3 provided in a table to each other, and by rotating the work carrier 4 and the table together. It is characterized by supplying slurry to a region, wherein the polishing cloth 3 compressed by being pressed to the semiconductor wafer with rotation of the table recovers, so that the polishing cloth 3 absorbs the slurry. <P>COPYRIGHT: (C)2011,JPO&INPIT |
