| 摘要 |
<P>PROBLEM TO BE SOLVED: To further improve the reliability of a semiconductor light-emitting element and a yield for manufacturing the semiconductor light-emitting element. <P>SOLUTION: A manufacturing method for a semiconductor light-emitting element has a step for selectively forming a plurality of semiconductor laminates including a first semiconductor layer, a second semiconductor layer, and a light-emitting layer formed between the first semiconductor layer and the second semiconductor layer on a first main surface of a support substrate with a space therebetween, a step for bonding each of the plurality of semiconductor laminates and the other support substrate to each other by a bonding material, and a step for peeling off the support substrate from the plurality of semiconductor laminates by making a laser beam incident from a second main surface at a side opposite to the first main face of the support substrate and irradiating the plurality of semiconductor laminates with the laser beams without irradiating the bonding material with the laser beam. <P>COPYRIGHT: (C)2011,JPO&INPIT |
