发明名称 METHOD OF CONTROLLING ETCH MICROLOADING FOR A TUNGSTEN-CONTAINING LAYER
摘要 A method for etching features of different aspect ratios in a tungsten containing layer is provided. An etch gas is provided containing a tungsten etch component and a deposition component. A plasma is formed from the provided etch gas. A tungsten containing layer patterned with wide and narrow features is etched with the provided plasma.
申请公布号 US2011151670(A1) 申请公布日期 2011.06.23
申请号 US20080744012 申请日期 2008.11.13
申请人 LAM RESEARCH CORPORATION 发明人 LEE WONCHUL;FU QIAN;LIU SHENJIAN;PU BRYAN
分类号 H01L21/3065 主分类号 H01L21/3065
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