PROBE APPARATUS FOR A WAFER SOLDER BUMP

摘要

The present invention provides a probe apparatus for a wafer solder bump. The probe apparatus for a wafer solder bump comprises: a support unit mounted on an upper surface of a printed circuit board; a flexible circuit board which has a connection pattern connected to solder bumps formed on a wafer, and which has a predetermined length, and a bottom surface mounted on an upper surface of the support unit, and both ends electrically connected to predetermined portions of the printed circuit board; a main fixing unit which is fitted into a rim of the support unit so as to fix the flexible circuit board tightly to an outer surface of the support unit; and a sub fixing unit which is arranged on the printed circuit board so as to tightly fix both ends of the flexible circuit board using an elastic force. Accordingly, the apparatus of the present invention prevents the solder bumps and the flexible circuit board from being warped, and thus prevents faults in the electrical connection of the wafer, when an electrical test for the wafer is performed using the solder bumps formed on a lower surface of the wafer.