METHODS FOR PASSIVELY ALIGNING OPTO-ELECTRONIC COMPONENT ASSEMBLIES ON SUBSTRATES

摘要

A method for aligning an opto-electronic component assembly (OECA) on a substrate includes positioning a substrate on an assembly surface and positioning an OECA on the substrate such that a first OECA alignment face projects from a first substrate alignment face. The substrate and the OECA are advanced towards a contact face of a first assembly alignment mechanism such that the first substrate alignment face contacts the contact face of the first assembly alignment mechanism after the first OECA alignment face contacts the contact face. The OECA is displaced relative to the first substrate alignment face when the first OECA alignment face contacts the contact face and the substrate continues to move towards the contact face thereby aligning the OECA on the substrate relative to the first substrate alignment face.