发明名称 |
METHOD OF MANUFACTURING PIEZOELECTRIC DEVICE |
摘要 |
A method of manufacturing a piezoelectric device includes the steps of bonding a first substrate to a second substrate having a toughness greater than that of the first substrate, forming a first though-hole through the first substrate from the side opposite to the side on which the second substrate is bonded, and forming a second through-hole through the second substrate at a location corresponding to the first through-hole by a formation method different from that used to form the first through-hole from the side opposite to the side on which the first substrate is bonded. |
申请公布号 |
US2011146041(A1) |
申请公布日期 |
2011.06.23 |
申请号 |
US20100968303 |
申请日期 |
2010.12.15 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
MIYAKE TAKASHI;TOYOTA YUJI |
分类号 |
H01L41/22 |
主分类号 |
H01L41/22 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|