| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform an electric characteristics inspection using a testing land even when a wiring board is downsized in a surface mount semiconductor device having the testing land on the undersurface of the wiring board on which a semiconductor chip is mounted. <P>SOLUTION: On the lower surface of the wiring substrate 301, a lower surface side land 315 to which a solder ball 305 is connected and a testing land 315L to which the solder ball 305 is not connected are formed. The testing land 315L is formed so that its diameter DL is larger than the diameter DB of the lower surface-side land 315 in order to reduce faulty contact with a land contacting contact pin 13L provided in a probe socket 10. <P>COPYRIGHT: (C)2011,JPO&INPIT |
