发明名称 METHOD AND DEVICE FOR FORMING PATTERNS USING RETICLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method and a device for forming a plurality of patterns using one reticle in semiconductor lithography. <P>SOLUTION: In the method for forming a chip pattern including a plurality of different patterns to resists on a wafer, the reticle with a plurality of different patterns in a plurality of regions is used, a first region is selected from the plurality of regions, the plurality of regions except a part of the first region are light-shielded by a blind, a part of the first region is irradiated with light and a first pattern is formed to the resist. In the method forming a second pattern, a second region different from the first region is selected out of the plurality of regions, the plurality of regions except a part of the second region are light-shielded by the blind, a part of the second region is irradiated with light, and the pattern is formed to the resist. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011124356(A) 申请公布日期 2011.06.23
申请号 JP20090280129 申请日期 2009.12.10
申请人 DAINIPPON PRINTING CO LTD 发明人 TAKAGAKI TATSURO
分类号 H01L21/027;G03F1/00;G03F1/70 主分类号 H01L21/027
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