| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate treatment method and a substrate treatment apparatus that can effectively suppress the collapse of a pattern on the surface of a substrate. <P>SOLUTION: The substrate treatment method includes an insulating liquid supplying step wherein an insulating liquid 21 having a specific resistance higher than or equal to that of pure water is supplied onto the surface of a substrate W with a thin-film pattern 10 formed on the surface thereof, an electrification step wherein a voltage is applied to the substrate W to electrify the thin-film pattern 10, and a drying step wherein the insulating liquid 21 is removed from the surface of the substrate W in parallel with the electrification step. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
