| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for accurately winding an unnecessary adhesive tape after being cut out along a contour of a semiconductor wafer and accurately applying the adhesive tape to the wafer. SOLUTION: The belt-like adhesive tape joined to the semiconductor wafer is cut out along the contour of the wafer by a tape cutting mechanism and, in a process of winding up the cut out unnecessary tape, a rotation angle of side rollers 36a, 36b guiding the narrowest section on both ends of the tape is detected by a rotary encoder 38. A determination section determines a fracture of the narrowest section of the unnecessary tape by comparing an actual rotation angle based on the measurement and a predetermined reference rotation angle. COPYRIGHT: (C)2011,JPO&INPIT |
