发明名称 SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND RECORDING MEDIUM RECORDING PROGRAM FOR IMPLEMENTING THE SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing device that can prevent a coating film formed through drying by a drying processing unit from having unevenness in film thickness without increasing the device cost, and to provide a substrate processing method. SOLUTION: The substrate processing device includes a conveyance path 34 and an air flow generation portion 110 which generates an air flow in a conveyance direction of the conveyance path 34 or in the opposite direction from the conveyance direction above a substrate G being conveyed in the conveyance path 34 in a state where a surface to be processed is coated with a processing liquid to perform the drying processing on the substrate G with the air flow. The air flow generation portion 110 is provided with a plurality of discharge sections 120 discharging a gas above the substrate G being conveyed in the conveyance path 34, and a plurality of suction sections 140 sucking the gas above the substrate G being conveyed in the conveyance path 34 such that they are arrayed alternately in the conveyance direction. The discharge members 120 each have a discharge port 122 for discharging the gas, and a supply flow passage 124 connecting the discharge port 122 to a supply system 112 for supplying the gas to the discharge port 122. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011124431(A) 申请公布日期 2011.06.23
申请号 JP20090281799 申请日期 2009.12.11
申请人 TOKYO ELECTRON LTD 发明人 OTA YOSHIHARU;MOTODA KIMIO;IKEDA FUMIHIKO
分类号 H01L21/027;B65G49/06;H01L21/677 主分类号 H01L21/027
代理机构 代理人
主权项
地址