发明名称 |
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND RECORDING MEDIUM RECORDING PROGRAM FOR IMPLEMENTING THE SUBSTRATE PROCESSING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device that can prevent a coating film formed through drying by a drying processing unit from having unevenness in film thickness without increasing the device cost, and to provide a substrate processing method. SOLUTION: The substrate processing device includes a conveyance path 34 and an air flow generation portion 110 which generates an air flow in a conveyance direction of the conveyance path 34 or in the opposite direction from the conveyance direction above a substrate G being conveyed in the conveyance path 34 in a state where a surface to be processed is coated with a processing liquid to perform the drying processing on the substrate G with the air flow. The air flow generation portion 110 is provided with a plurality of discharge sections 120 discharging a gas above the substrate G being conveyed in the conveyance path 34, and a plurality of suction sections 140 sucking the gas above the substrate G being conveyed in the conveyance path 34 such that they are arrayed alternately in the conveyance direction. The discharge members 120 each have a discharge port 122 for discharging the gas, and a supply flow passage 124 connecting the discharge port 122 to a supply system 112 for supplying the gas to the discharge port 122. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011124431(A) |
申请公布日期 |
2011.06.23 |
申请号 |
JP20090281799 |
申请日期 |
2009.12.11 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
OTA YOSHIHARU;MOTODA KIMIO;IKEDA FUMIHIKO |
分类号 |
H01L21/027;B65G49/06;H01L21/677 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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