| 摘要 |
PROBLEM TO BE SOLVED: To prevent circuit pattern collapse on a substrate, when cleaning the substrate. SOLUTION: After cleaning the substrate surface formed with circuit patterns by a cleaning liquid, the cleaned substrate surface is rinsed by a rinse liquid. Then, after the rinsing liquid remaining in each recess formed between the substrate circuit patterns is replaced by a filler and each recess is filled and solidified by the filler, the filler is removed from the substrate surface. A polymer is used as the filler. The polymer as the filler is removed by plasma processing in the removal process. A photoresist is used as the filler, and the photoresist as the filler is removed by development processing in the removal process. COPYRIGHT: (C)2011,JPO&INPIT |
