发明名称 |
SEMICONDCUTOR CHIP STACK AND MANUFACTURING METHOD THEREOF |
摘要 |
A semiconductor chip stack includes a first chip and a second chip. The first chip includes a first circuit formed in the first chip with a first integration density, and the second chip includes a second circuit in the second chip with a second integration density smaller than the first integration density. The first chip further includes at least a through-silicon via formed therein for electrically connecting the first chip and the second chip.
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申请公布号 |
US2011147909(A1) |
申请公布日期 |
2011.06.23 |
申请号 |
US20090641333 |
申请日期 |
2009.12.18 |
申请人 |
HSUAN JOHN;FENG TAI-SHENG |
发明人 |
HSUAN JOHN;FENG TAI-SHENG |
分类号 |
H01L23/60;H01L21/98 |
主分类号 |
H01L23/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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