发明名称 |
SUBSTRATE METALLIZATION AND BALL ATTACH METALLURGY WITH A NOVEL DOPANT ELEMENT |
摘要 |
Surface-active dopants are added to a portion of a circuit package before a reflow process to promote wetting and reduce the formation of solder bump bridges. The circuit package has a solder element that electrically connects the circuit package to a substrate. A reflow process is performed to attach the solder element to a pad on the circuit package. During the reflow process, the surface-active dopants diffuse to the surface of the solder element and form an oxide passivation layer on the surface of the solder element.
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申请公布号 |
US2011147066(A1) |
申请公布日期 |
2011.06.23 |
申请号 |
US20090641237 |
申请日期 |
2009.12.17 |
申请人 |
SIDHU RAJEN S;DANI ASHAY A;RENAVIKAR MUKUL P |
发明人 |
SIDHU RAJEN S.;DANI ASHAY A.;RENAVIKAR MUKUL P. |
分类号 |
H05K1/11;H01R9/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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