SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SAME

摘要

Disclosed is a semiconductor device having an element formation region (1A) wherein an element is formed on a semiconductor wafer (1), and a scribe region (3) formed on the periphery of the element formation region (1A) on the semiconductor wafer (1). Furthermore, the semiconductor device has a protective film (2) which is formed on and protects the element formation region (1A) and the scribe region (3).