| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the heat-release properties of a semiconductor device, and to improve the reliability. <P>SOLUTION: The semiconductor device 1 includes a wiring board 2, a heat sink 4 where a projection 12 is inserted into a through-hole 3 of the wiring board 2, a semiconductor chip 5 mounted on the projection 12 of the heat sink 4, and a bonding wire BW for connecting an electrode pad PD of the semiconductor chip 5 to a bonding lead BL of the wiring board 2. Furthermore, the semiconductor device 1 includes a sealing unit 7 for covering one portion of an upper surface 2a of the wiring board 2; a sealing unit 8 for covering one portion of a lower surface 2b of the wiring board 2, including the semiconductor chip 5 and the bonding wire BW; and a solder ball 9 provided on the lower surface 2b of the wiring board 2. When the semiconductor device 1 is to be manufactured, the heat sink 4 is disposed on the upper surface 2a of the wiring board 2 so that the projection 12 is located within the through-hole 3, and a groove 16 on the main surface 12a of the projection 12 is spread and caulks the projection 12 for fixing to the wiring board. <P>COPYRIGHT: (C)2011,JPO&INPIT |
