发明名称 INSULATING SHEET, LAMINATED STRUCTURE, AND MANUFACTURING METHOD OF LAMINATED STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an insulating sheet and a laminated structure high in handleability at a non-cured state, and capable of restraining warp of a laminated object laminated on a cured object. <P>SOLUTION: The insulating sheet contains a polymer with the weight-average molecular weight of 10,000 or larger and a skeleton derived from glycidyl (meth)acrylate, a curing compound with the weight-average molecular weight of smaller than 10,000 and with an epoxy group or an oxetane group, a curing agent, and a filler. An epoxy equivalent of the polymer is within a range of 200 to 1,000. The laminated structure 1 is provided with a substrate 2 having a first conductive layer 2b at least on one of its faces and either a through-hole or a concave part on one of the faces, insulating layers 3, 4 laminated on one or both faces of the substrate 2 and formed of the insulating sheet, and second conductive layers 5, 8 laminated on a face opposite to the face of the substrate 2 laminated with the insulating layers 3, 4 or a circuit board. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011124078(A) 申请公布日期 2011.06.23
申请号 JP20090280332 申请日期 2009.12.10
申请人 SEKISUI CHEM CO LTD 发明人 TAKAHASHI RYOSUKE;MAENAKA HIROSHI;AOYAMA TAKUJI;KUSAKA YASUNARI;INOUE TAKANORI;KONDO SHUNSUKE;YAMADA YU;WATANABE TAKASHI
分类号 H01B17/56;B32B7/02;H01L23/12;H01L23/14;H05K1/03;H05K3/46 主分类号 H01B17/56
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