| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave device that can be made thin, and a manufacturing method thereof. SOLUTION: The method for manufacturing the surface acoustic wave device includes steps for: flip-chip mounting a surface acoustic wave device chip on the top surface of a package substrate 2; sealing side surfaces of the surface acoustic wave device chip by a sealing part 8; and cutting the top surface of the surface acoustic wave device chip and the top surface of the sealing part 8. According to the invention, the surface acoustic wave device chip and the sealing part are cut to be reduced in height so that the surface acoustic wave device can be made thin. COPYRIGHT: (C)2011,JPO&INPIT
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