CIRCUIT BOARD WITH VIA TRACE CONNECTION AND METHOD OF MAKING THE SAME

摘要

Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board (320). The first interconnect layer includes a first conductor trace (420) with a first segment (530) that does not include a via land. A first via (440) is formed on the first segment (530).