| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric device wherein manufacturing costs are reduced, and also to provide a sealing method of the piezoelectric device. SOLUTION: The piezoelectric device is equipped with: a piezoelectric vibration chip 2; a package body 4 enclosing the piezoelectric vibration chip 2 and supporting a part thereof fixedly; and a cover 5 fixed to the package body 4 while having space to accommodate the piezoelectric vibration chip 2. A through hole 7 provided in a part of the cover 5 is arranged to be irradiated with a laser beam and heated, melted, and finally closed, thus eliminating the need for a filler which closes the through hole 7. COPYRIGHT: (C)2011,JPO&INPIT
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