| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit board having an insulating layer excellent in both thermal conductivity and adhesiveness. SOLUTION: The electronic circuit board 100 is constituted by laminating a metal base 101, a first resin layer 102 containing an inorganic filler, a second resin layer 103 containing no inorganic filler, and metal foil 104 for forming wiring patterns. Since the second resin layer 103 does not contain the inorganic filler, adhesiveness with the metal foil 104 can be improved. Moreover, adhesiveness between the first resin layer 102 and the second resin layer 103 can be improved by forming them with the same resins. Furthermore, a first coating film for the second resin layer 103 is formed on the metal foil 104, and a second coating film for the first resin layer 102 is formed without a solvent removing process, then, the solvent removing process is simultaneously applied to these first coating film and the second coating film. Thereby, adhesiveness between the first resin layer 102 and the second resin layer 103 can be further improved. COPYRIGHT: (C)2011,JPO&INPIT
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