THERMALLY CONDUCTIVE, ELECTRICALLY INSULATING COMPOSITE FILM AND STACK CHIP PACKAGE STRUCTURE UTILIZING THE SAME

摘要

Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously.