| 摘要 |
There are provided a substrate placing plate and a substrate processing apparatus using the substrate placing plate. The substrate processing apparatus comprises a process chamber configured to accommodate a substrate and perform a heat treatment on the substrate; and a substrate transfer machine configured to carry the substrate into the process chamber in a state where the substrate is placed on a substrate placing plate. The substrate placing plate comprises at least three substrate placing parts. The substrate placing parts are located on the same horizontal plane, and in a state where the substrate placing parts are located at a top side of the substrate placing plate, top surfaces of the substrate placing parts are higher than a surface of the substrate placing plate surrounded by the substrate placing parts and are higher than all peripheral surfaces of the substrate placing parts.
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