| 摘要 |
Microelectronic assemblies can have multiple conductive bond elements, e.g., bond wires, or a lead bond and a bond wire, extending between a pair of a substrate contact and a chip contact. E.g., a first bond wire can have ends joined to the contacts of the chip and substrate. A second bond wire can be joined to the ends of the first bond wire so that the second bond wire does not touch either the chip contact or the substrate contact to which the first bond wire is joined. In one example, a bond wire has a looped connection with first and second ends joined at a first contact and a middle portion joined to a second contact. In one example, first and second bond elements, e.g., bond wires or lead bonds can connect first and second pairs of a substrate contact with a chip contact. A third bond element, e.g., a bond wire or bond ribbon, can be joined to ends of the first and second bond elements. |
