发明名称 LASER BEAM MACHINING APPARATUS AND LASER BEAM MACHINING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus and a laser beam machining method for obtaining higher surface precision. SOLUTION: The laser beam machining apparatus includes: a laser beam irradiation mechanism which oscillates a laser beam and irradiates a workpiece with the laser beam at the fixed repetitive frequency, and performs scanning; a movable mechanism for holding and moving the workpiece, and a control unit which controls the laser beam irradiation mechanism to execute the scanning with the laser beam in the circular motion at the fixed speed, controls the moving mechanism to execute machining while moving the workpiece at the fixed moving speed in the specified direction, and sets the position of the laser beam locus group at the time. The control unit executes the machining by shifting the laser beam locus groups several times, and also executes the setting that a portion with non-dense irradiation of the laser beam in one locus group out of the laser beam locus groups with a part thereof overlapped each other and a portion with dense irradiation of the laser beam in the other locus group are superposed on each other. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011121094(A) 申请公布日期 2011.06.23
申请号 JP20090281061 申请日期 2009.12.10
申请人 MITSUBISHI MATERIALS CORP 发明人 TAKAHASHI MASAKUNI;HIGANO SATORU
分类号 B23K26/04;B23K26/08;B23K26/36;B23K26/40;B23P15/28 主分类号 B23K26/04
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