| 摘要 |
PROBLEM TO BE SOLVED: To provide a mechanism achieving cost reduction of electronic equipment by assuring a favorable heat insulating performance without using an expensive heat insulating material. SOLUTION: The electronic equipment includes: a first cover part 12 disposed to cover a circuit board 11 which is an example of a heat source provided on an equipment body 10; and a second cover part 13 covering the outside of the first cover part 12. A plurality of almost sealed and independent air layers are formed between the first cover part 12 and the second cover part 13. COPYRIGHT: (C)2011,JPO&INPIT |
