发明名称 |
Multi-tiered Circuit Board and Method of Manufacture |
摘要 |
The present invention provides a printed circuit board assembly that includes a first printed circuit board portion having a first thickness and including at least one plated through hole selectively electrically interconnecting electrically conductive layers of the printed circuit board assembly. A second printed circuit board portion is also provided that has a second thickness which is less than the first thickness and further includes another a second plated through hole array exposed on a surface of the second printed circuit board portion.
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申请公布号 |
US2011147069(A1) |
申请公布日期 |
2011.06.23 |
申请号 |
US20090642020 |
申请日期 |
2009.12.18 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
QUACKENBUSH RICHARD A.;SU JAMES;WILSON JOHN T. |
分类号 |
H05K3/02 |
主分类号 |
H05K3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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