| 发明名称 |
SOLDER PASTE FLUX AND SOLDER PASTE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide flux for solder paste and solder paste having adequate fluidity even when the shear force is repeatedly applied thereto, and capable of suppressing any fatigue degradation of the viscoelastic characteristic and various kinds of performance degradation due to the same. <P>SOLUTION: The flux for solder paste comprises acrylic resin which is obtained by the radical copolymerization of (meth)acrylic ester having a 6-15C alkyl group and (meth)acrylic ester other than that (meth)acrylic ester, and rosins. The weight ratio of the acrylic resin when that of rosins is 1 is 0.5-1.2, and the flux for solder paste is fluidized by applying the shear force of 10-150 Pa. <P>COPYRIGHT: (C)2011,JPO&INPIT |
| 申请公布号 |
JP2011121059(A) |
申请公布日期 |
2011.06.23 |
| 申请号 |
JP20090278210 |
申请日期 |
2009.12.08 |
| 申请人 |
ARAKAWA CHEM IND CO LTD;TOYOTA MOTOR CORP;DENSO CORP;FUJITSU TEN LTD;KOKI:KK;HARIMA CHEMICALS INC |
发明人 |
IWAMURA EIJI;GOTO KAZUYUKI;NAGASAKA SHINSUKE;YOSHIOKA TAKAYASU;UTSUNO KIMITAKA;NAKAMURA MITSUO;OKOCHI TERUO;MITSUHARU MASAKI;SUKEGAWA TAKUSHI;IKEDO KENJI;ANDO YOSHIYUKI;SHIRAI TAKESHI;MORI KIMIAKI;WADA RIE;NAKANISHI KENSUKE;AIHARA MASAMI;KUMAMOTO SATOSHI |
| 分类号 |
B23K35/363;B23K35/22;B23K35/26;C22C13/00 |
主分类号 |
B23K35/363 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
