| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric device which can be manufactured with sufficient accuracy while simplifying a manufacturing process. SOLUTION: The piezoelectric device includes: a piezoelectric vibration chip 2, a package body 4 comprising a glass substrate and supporting a part of the piezoelectric vibration chip 2 fixedly, and a cover 5 fixed to the package body 4 and having space to accommodate the piezoelectric vibration chip 2. The package body 4 has through-holes 6 and 7. The cross-sectional shape of the through-holes 6 and 7 in the length direction is narrow in the center for the openings on the both sides. Furthermore, a conductive film 13 is formed on the inner peripheral surface of the through-holes 6 and 7. The central part of the through-holes 6 and 7 in the length direction is filled and sealed with the same material as that of the conductive film 13. COPYRIGHT: (C)2011,JPO&INPIT
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