SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, CIRCUIT BOARD, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To improve connection reliability between a circuit board and a semiconductor element. SOLUTION: The circuit board 20 and a semiconductor element 10 are electrically connected to each other through projecting electrodes 13 formed on the semiconductor element 10. The tip 13a of each projecting electrode 13 of the semiconductor element 10 is joined to a first region 25a of an electrode part 25 formed on the circuit board 20. A conductive part 50 is joined to a second region 25b of the electrode part 25 around the first region 25a and side faces 13b of the projecting electrode 13. COPYRIGHT: (C)2011,JPO&INPIT