| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an artifice improving the uniformity of a height of an underfill formed on an end surface around a semiconductor element by a simple method to improve quality and reliability of a semiconductor device. <P>SOLUTION: A semiconductor device includes: a circuit board 2 having a plurality of surface electrodes made of a metal on a surface thereof and external connection terminals 4 made of a metal while arranged in a grid on a rear surface thereof; a semiconductor element 1 flip-chip connected to the surface electrodes of the circuit board and having a rectangular plate shape; and an underfill resin 3 existing between the circuit board and the semiconductor element while being brought into contact with the four sides of the rectangle of the semiconductor element. A dam member 8 surrounding the semiconductor element is formed on the surface of the circuit board, and a distance between the dam member and the semiconductor element is smaller at the corner than at the center of the side of the semiconductor element. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
