发明名称 CIRCUIT BOARD, HIGH HEAT RADIATION CONNECTOR, METHOD FOR MANUFACTURING THE SAME, AND CIRCUIT MODULE WITH CONNECTOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a high heat radiation connector, achieving high heat radiation property, reduced size and reliable joining. <P>SOLUTION: A high heat radiation connector such as an LED element connector 50, a circuit board 10 using the high heat radiation connector, and a circuit module 1 are constituted. The heat radiation connector includes: a heat conduction plate having first and second surfaces 50A and 50B; a first hole 51 engageable to a heat conduction pin 40 and a second hole 52 engageable to a terminal pin 30 for electrical connection, wherein the first and second holes are formed in the first surface 50A; and a connection terminal 53 formed in the second surface 50B and electrically connected to the terminal pin 30. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011124386(A) 申请公布日期 2011.06.23
申请号 JP20090280912 申请日期 2009.12.10
申请人 IBIDEN CO LTD 发明人 FURUICHI WATARU
分类号 H01L23/12;H01L23/32;H01L23/36;H05K1/02 主分类号 H01L23/12
代理机构 代理人
主权项
地址