| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold package of a structure that facilitates recognizing the presence of solder on the backside of a lead by using a simple manufacturing process. SOLUTION: A part of a metal pattern 100 is buried in a mold material 24, and a T-shape structure is exposed on the lower surface (backside). On the backside, recesses 16 are formed at two points of the backside of a common lead 12 with a lateral section bar 13 sandwiched. As shown in Fig.7(b), half cut processing is executed in a region including the recesses 16 from the upper mold material 24 side (mold separating process). Then, as shown in Fig.7(d), a portion between two through-holes 40 (recesses 16) is subjected to full cut processing (cutting process). After the cutting process, the common lead 12 is divided in right and left and is to be a lead 50. The through-holes 40 are formed on the center of the lead 50. COPYRIGHT: (C)2011,JPO&INPIT |
