| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic element device with a high numerical aperture equivalent to an etching from a substrate surface, by which any expensive manufacturing apparatus and any additional process are not required, and any sticking is not generated, either. SOLUTION: The method of manufacturing the electronic element device has the steps of: partially protecting an electronic element 2 with a mask material so that the electronic element 2 may be covered, while loading the electronic element 2 on a first principal plane of a substrate 1; and simultaneously carrying out a crystal anisotropic etching of the first principal plane and a second principal plane of the substrate 1 in the state where the whole second principal plane of the substrate 1 is exposed, and ending the etching after forming a through-hole by overlapping a region etched from the first principal plane, and a region etched from the second principal plane. COPYRIGHT: (C)2011,JPO&INPIT
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