| 摘要 |
PROBLEM TO BE SOLVED: To provide a foreign matter removing device for substrate with capability to successfully remove organic foreign matter sticking to the surface of a substrate in a manufacturing process, without leaving tailings unremoved and injuring the surface of the substrate, as well as a method for removing the foreign matter for substrates. SOLUTION: The organic foreign matterαis specified by observing the surface of the substrate BS, and the positions of the foreign matter removing device for substrates and the organic foreign matterαon the substrate BS are registered. Next, a photocatalytic tape PHT is made to descend and a photocatalytic layer of the photocatalytic tape PHT is contact-bonded to the organic foreign matterα. After that, the light is shined from the opposite side, to the surface which is contact-bonded to the organic foreign matterα, of the photocatalytic tape PHT by actuating a light irradiation means 400. The organic foreign matterαis photooxidized by the action to absorb the light by the photocatalyst and consequently, the organic foreign matterαis decomposed and removed, thus completing the removal of the foreign matterα. COPYRIGHT: (C)2011,JPO&INPIT |
