| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of processing a wafer free from sagging and chipping on its outer periphery. SOLUTION: The method of processing the wafer having on its surface a device region in which a plurality of devices are formed in a lattice and which is formed in a region sectioned by a scheduled split line and an outer peripheral surplus region surrounding the device region includes the protective tape sticking step of sticking a protective tape onto the surface of the wafer, the auxiliary ring forming step of suction-holding the protective tape side by a chuck table, positioning a cutting blade on a boundary part between the device region and the outer peripheral surplus region from the rear surface of the wafer and cutting the wafer to form a ring-shaped cutting groove and to leave the outer peripheral surplus region as an auxiliary ring, the rear surface grinding step of grinding the rear surface of the wafer corresponding to the device region and the rear surface corresponding to the outer peripheral surplus region to form the wafer to have a predetermined thickness, and the polishing step of polishing the entire of the ground rear surface of the wafer by a polishing pad. COPYRIGHT: (C)2011,JPO&INPIT |
