| 摘要 |
The invention relates to an electrical and/or electronic device (300) comprising: an electrical and/or electronic component (106a, 106b); two layers (102, 104) of material forming front and rear surfaces of the device, the component being encapsulated therebetween and moreover comprising at least two opposite surfaces (108a, 108b, 110a, 110b) that are placed facing both layers of material; an electrical contact element (112a, 112b, 114a, 114b) that is placed against one of the surfaces of the electrical and/or electronic component; and an element (302) that is made of a resilient material and placed between one of the two layers of material and the electrical contact element, thus forming a first layer of resilient material that covers said one of the two layers of material and a second layer (304) that is made of a resilient material having a stiffness less than that of the resilient material of the first layer, said second layer moreover being placed against the first layer of resilient material. |
