发明名称 |
LAMINATION METHOD AND LAMINATION DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a lamination method and a lamination device capable of obtaining lamination with stable quality by maintaining the temperature of a diaphragm for pressure bonding of a target from an initial stage of work at a constant level. SOLUTION: The lamination method for pressure bonding the target of a chamber includes: a step S110 of arranging the target in the chamber; a step S120 of making the diaphragm having an elastic material quality come into close contact with a first heater to preheat the diaphragm to a predetermined preheating temperature; and a step S130 of pressure bonding the target by the diaphragm. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011121355(A) |
申请公布日期 |
2011.06.23 |
申请号 |
JP20100113412 |
申请日期 |
2010.05.17 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
CHOI HEE SUNG;JEON SANG YOUL |
分类号 |
B29C65/20 |
主分类号 |
B29C65/20 |
代理机构 |
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代理人 |
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地址 |
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