发明名称 LAMINATION METHOD AND LAMINATION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a lamination method and a lamination device capable of obtaining lamination with stable quality by maintaining the temperature of a diaphragm for pressure bonding of a target from an initial stage of work at a constant level. SOLUTION: The lamination method for pressure bonding the target of a chamber includes: a step S110 of arranging the target in the chamber; a step S120 of making the diaphragm having an elastic material quality come into close contact with a first heater to preheat the diaphragm to a predetermined preheating temperature; and a step S130 of pressure bonding the target by the diaphragm. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011121355(A) 申请公布日期 2011.06.23
申请号 JP20100113412 申请日期 2010.05.17
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 CHOI HEE SUNG;JEON SANG YOUL
分类号 B29C65/20 主分类号 B29C65/20
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