| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of supporting an electronic component that can prevent an error operation because of a crack of soldered joint resulting from dynamic force, and to provide an electronic device for supporting an electronic component reliably. SOLUTION: The electronic device includes a printed circuit substrate 14 and a structure component 15 to cover at least a part of the PCB 14. The method includes a step to mount the electronic component 17 on the PCB 14, a step to supply an elastically compressible impact absorbable component 18 on the area 22 of the structure component 15, and a step to assemble the PCB 14 and structure component 15. The impact absorbing component 18 is composed to cover the electronic component 17. When assembling, the elastically compressible impact absorbing component 18 is located so as to affect an pressure onto the electronic component 17 on the PCB 14. The electronic device whose elastically-compressible impact absorbing component 18 is located between the structure component and PCB is disclosed. COPYRIGHT: (C)2011,JPO&INPIT
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