MULTI-TIERED CIRCUIT BOARD AND METHOD OF MANUFACTURE
摘要
The present invention provides a printed circuit board assembly that includes a first printed circuit board portion having a first thickness and including at least one plated through hole selectively electrically interconnecting electrically conductive layers of the printed circuit board assembly. A second printed circuit board portion is also provided that has a second thickness which is less than the first thickness and further includes another a second plated through hole array exposed on a surface of the second printed circuit board portion.
申请公布号
WO2011072990(A2)
申请公布日期
2011.06.23
申请号
WO2010EP67964
申请日期
2010.11.23
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION;IBM UNITED KINGDOM LIMITED;SU, JAMES;QUACKENBUSH, RICHARD, ALAN;WILSON, JOHN, THOMAS
发明人
SU, JAMES;QUACKENBUSH, RICHARD, ALAN;WILSON, JOHN, THOMAS