发明名称 |
SUSPENSION CIRCUIT SUBSTRATE, HARD DISK-USE SUSPENSION AND HARD DISK DRIVE |
摘要 |
<p>A suspension circuit substrate (1) is provided with a metal support substrate (12), a first insulating layer (11) disposed upon the metal support substrate (12) and comprising insulating material, a conductive layer (10) disposed upon the first insulating layer (11) and constituting a wire, and a second insulating layer (13) disposed upon the first insulating layer (11) and the conductive layer (10) and comprising insulating material. The suspension circuit substrate (1) is constituted so that when a load is applied in a thickness direction at a position corresponding to a first insulating aperture portion (11O) of the conductive layer (10), if it is assumed that a first stress F1 is a stress generated in the conductive layer (10) at a position corresponding to a periphery of the first insulating aperture portion (11O), and a second stress F2 is a stress generated in the conductive layer (10) at a position corresponding to a periphery of the metal support substrate aperture portion (12O), then F1 2.</p> |
申请公布号 |
WO2011074422(A1) |
申请公布日期 |
2011.06.23 |
申请号 |
WO2010JP71577 |
申请日期 |
2010.12.02 |
申请人 |
DAI NIPPON PRINTING CO., LTD.;BUSUJIMA SHINICHIRO;MIURA YOICHI;HIRATA KENRO;YAMAOKA TEMPEI |
发明人 |
BUSUJIMA SHINICHIRO;MIURA YOICHI;HIRATA KENRO;YAMAOKA TEMPEI |
分类号 |
G11B5/60;G11B21/21;H05K1/02 |
主分类号 |
G11B5/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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