| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the generation of wire bonding failure in a flat type semiconductor device. <P>SOLUTION: The invention relates to a method of manufacturing a semiconductor device in which a plurality of semiconductor chips 12 are mounted on a plurality of chip mounting regions 20a which a wiring board 40 has, through a liquid adhesive paste 11a, respectively. The wiring board 40 is formed as follows, that is, among a plurality of the chip mounting regions 20a arranged next to each other in each device region 40a, terminals (bonding leads) 22 are not arranged, but groove parts (dam parts) 26b which are formed in an insulating film 26 covering the wiring board 40, is arranged. <P>COPYRIGHT: (C)2011,JPO&INPIT |
