| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device in which fixed abrasive grains for achieving high machining accuracy are used. <P>SOLUTION: This polishing device for polishing the surface to be worked of a workpiece includes a surface plate rotated about a first rotating axis, a porous grinding wheel which is attached to the upper surface of the surface plate, on which a working surface brought into contact with the surface to be worked of the workpiece is formed, and which comprises abrasive grains, a binder, and pores, a holding part which is rotated about a second rotating axis displaced from the first rotating axis and holds a plurality of workpieces while allowing the porous grinding wheel and the workpiece to slide relative to each other with the machining surface of the porous grinding wheel on the surface plate brought into contact with the surface to be worked of the workpiece, a fluid passage for flowing water which is formed in the surface plate, which is opened to the upper surface of the surface plate, and which communicates with the working surface of the porous grinding wheel through the pores of the porous grinding wheel, a pump which is connected to the fluid passage for flowing water and which supplies pressurized water to the fluid passage for flowing water, and a control unit which operates the pump when detecting a stop signal for stopping the rotation of the surface plate and the holding part to discharge the water supplied from the pump to the working surface through the fluid passage for flowing water and the pores. <P>COPYRIGHT: (C)2011,JPO&INPIT |
