发明名称 ANTI-DISPLACEMENT HARD GOLD COMPOSITION
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a plating liquid composition, when hard gold is spot-plated on a nickel-coating substrate such as an electric connector, which inhibits the displacement plating of gold on the part other than the plated part. <P>SOLUTION: The composition includes a gold ion source, a metal ion source including a cobalt salt or a nickel salt, and mercaptotetrazole shown by formula I or the salt thereof (wherein R<SB>1</SB>denotes hydrogen, 1C-20C hydrocarbon group, 8C-20C aralkyl, phenyl, naphthyl, amine or a carboxyl group; and X denotes hydrogen, 1C-2C alkyl or an alkali metal such as calcium, ammonium or quaternary amine, being suitable counter ions). <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011122236(A) 申请公布日期 2011.06.23
申请号 JP20100213061 申请日期 2010.09.24
申请人 ROHM & HAAS ELECTRONIC MATERIALS LLC 发明人 ZHANG WAN;GUEBEY JONAS;EGLI ANDRE
分类号 C25D3/62;C25D7/00 主分类号 C25D3/62
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