发明名称 |
METHOD FOR CONNECTING LAYERS |
摘要 |
Method for connecting several layers made from a semiconductor material and a replacement substrate comprises using a joining layer formed by thermal compression. The layers contains a thermally connecting material. Independent claims are also included for the following: (1) Component, especially a wafer, comprising a semiconductor material and a joining layer; (2) Method for the production of organic luminous diode; and (3) Organic luminous diode produced using the above method. |
申请公布号 |
EP1929515(B1) |
申请公布日期 |
2011.06.22 |
申请号 |
EP20060791398 |
申请日期 |
2006.09.22 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
GROLIER, VINCENT;PLOESSL, ANDREAS;RENNER, MARIANNE |
分类号 |
H01L21/603;H01L51/52 |
主分类号 |
H01L21/603 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|