HEAT DISSIPATION DEVICE AND CIRCUIT BOARD HAVING THE SAME

摘要

PURPOSE: A heat dissipation device and a circuit board having the same are provided to improve radiation efficiency of a heating device by using a thermoelectric element. CONSTITUTION: A heat dissipation device includes a heating device, a thermoelectric element(120), and radiating unit. The thermoelectric element cools down the heating device. The radiating unit releases the heat from the thermoelectric element to outside. A heat pipe transfers the heat of the thermoelectric element. The heat sink releases the heat of the heat pipe to outside. The thermoelectric element is interposed between a printed circuit board(110) and the heating device.