发明名称 |
METHOD FOR FORMING PIEZLELETRIC THICK LAYER |
摘要 |
PURPOSE: A method for forming a piezoelectric thick layer is provided to easily the thickness and size of a piezoelectric thick film by coating a solvent including at least one organic compound with a solution with dissolved P(VDF-TrFE) powder through a tap casting. CONSTITUTION: In a method for forming a piezoelectric thick layer, piezoelectric powder is dissolved by a solvent including at least one organic compound(S110). A first electrode is formed on the too side of a substrate. A solution is coated on the top side of the substrate through a tape-casting(S130). A piezoelectric thick film is formed by performing a thermal process of the substrate on which the solution is coated(S150). A second electrode is formed on the top of the solution passing the thermal process. A substrate is removed from the piezoelectric thick film(S170).
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申请公布号 |
KR20110067978(A) |
申请公布日期 |
2011.06.22 |
申请号 |
KR20090124782 |
申请日期 |
2009.12.15 |
申请人 |
KIM, SUNG CHUL |
发明人 |
KIM, SUNG CHUL;NO, KWANG SOO;PARK, MOON KYU;CHOI, YOON YOUNG;AHN, GUN |
分类号 |
H01L41/08 |
主分类号 |
H01L41/08 |
代理机构 |
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主权项 |
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地址 |
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